SOLDERING GLOSSARY
|
ENGLISH |
FRENCH |
|
alloy |
alliage |
|
analogic;
linear integrated circuit |
circuit
integre analogique |
|
assemblly |
ensemble |
|
ATE
(automatic test equipment) |
appareil
de verification automatique |
|
axial
leads component |
composant
à sorties axiales |
|
baking |
etuvage |
|
base
metal |
metal
de base |
|
bevel |
chanfrein |
|
bevelling |
chanfreinage |
|
BGA
(ball grid array) |
boitier
BGA (boitier à contacts perles) |
|
BGA,
column (column ball grid array) |
boitier
BGA à colonnes (boltier à contacts perles semi-rigid |
|
birdcage |
separation
des brins |
|
blanking |
decoupage
à la presse |
|
blow
hole |
Soufflu
re |
|
board |
carte;
plaquette |
|
BQFP
(bumper quad flat pack) |
boitier
quadrangulaire plat à pare-chocs |
|
brass |
laiton |
|
braze |
brasure |
|
Brazing |
brasage |
|
brazing
metal |
metal
d'apport |
|
break |
cassure |
|
bridge
rectifier |
pont
redresseur |
|
bur(r) |
burin |
|
burnishing |
polissage |
|
bus
bar |
barre
omnibus |
|
bus
wire |
fil
de jonction ou de liaison |
|
butt
joint |
assemblage/joint
bout à bout |
|
CAD
(computer aided design) |
DAO
(dessin assiste par ordinateur) |
|
CAM
(computer aided manufacture) |
FAO
(fabrication assistee par ordinateur) |
|
capacitor,
adjustable (trimmer capacitor) |
condensateur
ajustable (variable) |
|
capacitor,
aluminum electrolytic |
condensateur
electrolytique à ('aluminium |
|
capacitor,
mica |
condensateur
au mica |
|
capacitor,
multilayer ceramic |
condensateur
ceramique multicouche |
|
capacitor,
plastic film |
condensateur
à film plastique |
|
capacitor,
tantalum electrolytic |
condensateur
electrolytique au tantale |
|
capillarity |
capillarite |
|
CBGA
(ceramic ball grid array) |
boitier
CBGA (boitier ceramique à contacts perles) |
|
CERDIP
(ceramic dual-in-line package) |
boitier
ceramique à deux rangees de broches |
|
CFC
(chlorinated fluoro carbons) |
FCC
(fluoro carbones chlorines) |
|
chip |
puce;
circuit integre |
|
chip
capacitor |
condensateur
miniature |
|
chip
carrier |
porte-puce;
boitier pave |
|
chip
component |
composant
miniature |
|
chip
resistor |
resistance
miniature |
|
CLCC
(ceramic leaded chip carrier) |
boitier
ceramique avec broches |
|
clearance |
degagement |
|
clinched
lead |
sortie
repliee; connexion rabattue |
|
CMOS
(complementary metal oxide semiconductor) |
CMOS
uSOMC» (semi-conducteur à oxyde de metal |
|
|
complementaire) |
|
COB (chip on board) |
COB (Cl sur plaquette) |
|
component
hole |
trou
de connexion |
|
component
lead |
patte
de composant; broche; terminaison; sortie |
|
component
mounting |
montage
des composants |
|
component
side |
cOte
composant |
|
conduction
soldering |
soudage;
brasage par conduction |
|
Conductor |
conducteur;
piste |
|
conformal coating |
vernis de recouvrement; vernis de
tropicalisation |
|
connection |
connexion |
|
connector |
connecteur |
|
contact finger |
doigts de contact |
|
contact finger plating |
revetement metallique des doigts de contact |
|
contact pad |
surface de contact; plage de contact |
|
contaminant |
contaminant |
|
copper electroplating |
cuivrage electrolytique |
|
copper etching |
gravure du cuivre |
|
copper foil |
feuille de cuivre |
|
copper-clad laminate |
stratifie cuivre |
|
CPS (cycles per second) |
CPS (cycles par seconde) |
|
CQFP (ceramic quad flat pack) |
boitier ceramique plat, quadrangulaire |
|
crack, crater |
fissure de cratere |
|
crading |
fissuration |
|
crater |
cratere |
|
CRT (cathode ray tube) |
TRC (tube a rayons cathodiques) |
|
CTE (coefficient of thermal expansion) |
CET (coefficient d'expansion thermique) |
|
curing |
cuisson |
|
DCA (direct chip attach) |
DCA (attache directe de composant) |
|
deburring |
ebavurage; ebarbage |
|
degreaser |
degraissant |
|
degreasing |
degraissage |
|
development |
developpement |
|
DFM (design for manufacturability) |
DPF (dessin pour fabrication) |
|
dip |
bain |
|
DIP (double-in-line package) |
boitier DIP; boitier a deux rangees de
broches |
|
dipping |
trempage |
|
disturbed solder joint |
joint brase perturbe; brasure perturbee |
|
DPM (defect per million) |
DPM (defaut par million) |
|
DRAM (dynamic random access memory) |
DRAM (memoire a acces aleatoire dynamique) |
|
drill bit |
lore,; meche |
|
drilling |
pergage |
|
drilling machine |
perceuse |
|
dross (solder) |
ecume (soudure) |
|
dry film |
film sec |
|
ductility |
ductilite |
|
dummy component |
composant factice |
|
edge connector |
connecteur encartab!e |
|
EIA (Electronic Industries Association) |
EIA (Association des industries
electroniques) |
|
electroless copper deposit |
depot chimique de cuivre |
|
electroless copper plating |
cuivrage chimique |
|
electroplated copper |
depot de cuivre par electrolyse |
|
electroplated tin-lead |
depot electrolytique d'etain-plomb |
|
EMC (electromagnetic compatibility) |
EMC (compatibilite electromagnetique) |
|
EMI (electromagnetic interference) |
EMI (interference electromagnetique) |
|
EMPF (electronics manufacturing
productivity facility) |
EMPF (facilite de fabrication productive
electroni(Iue) |
|
epoxy-glass laminate |
stratifie verre-epoxyde |
|
EPROM (erasable programmable read only
memory) |
EPROM (memoire a lecture seule, effacement |
|
|
programmable) |
|
ESD (electrostatic discharge) |
DES (decharge electrostatique) |
|
etch resist |
masque de gravure |
|
etchant |
agent de gravure; mordant |
|
etchback |
retrogravure; gravure en retrait |
|
eyelet |
oeillet |
|
eyepad, conductor, land |
pastille; conducteur; piste |
|
exposure |
Exposition |
|
file |
Lime |
|
fillet,
concave |
filet;
conge; cordon : concave |
|
fillet,
convex |
filet;
conge; cordon : convexe |
|
final
inspection |
verification
finale |
|
fine
pitch component |
composant
à peigne fin |
|
fluidity |
fluidite |
|
flux |
decapant;
flux |
|
fractured
solder joint |
joint
brase fissure; brasure fissuree |
|
FRS
(fatigue resistant solder) |
FRS
(soudure resistante à la fatigue) |
|
FRU
(field replaceable unit) |
FRU
(unite remplaceable sur le terrain) |
|
fusion,
incomplete |
collage |
|
gas
pocket |
soufflure |
|
gas
pore |
piqure |
|
gold
plating |
dorure |
|
gravity |
gravity |
|
ground |
masse |
|
ground
connection |
mise
à la masse |
|
lug
terminal |
cosse
plate; picot plat; cosse à oeil |
|
gull
wing components |
composants
à sorties en "L" |
|
haloing |
effet
de halo |
|
HASL
(hot air solder levelling) |
HASL
(nivelage de soudure à fair chaud) |
|
HCFC
(hydrogenated chloro fluoro carbon) |
HCFC
(fluoro carbones chlorines hydrogenes) |
|
heat
sink |
dissipateur
thermique; radiateur |
|
heel |
talon |
|
hole
sidewall |
paroi
de trou |
|
hot
air solder levelling (HASL) |
nivelage
de I'etain-plomb à ('air chaud |
|
hybrid
circuit |
circuit
hybride |
|
hydraulic
press |
presse
hydraulique |
|
IC
(integrated circuit) |
Cl
(circuit integre) |
|
icicle |
glagon;
pic |
|
image
transfer; imaging |
report
de ('image; transfert de I' image |
|
inner
layer |
couche
interne |
|
insulation |
isolant |
|
integrated
circuit (IC) |
circuit
integre (CI) |
|
interlayer
connection |
connexion
inter-couche |
|
IPC
(Institute for Interconnecting and Packaging |
IPC
(Institut pour emboitage et ('interconnection des circuits |
|
Electronic
Circuits) - procedures standards |
electronique)
- normes de procedures |
|
IR
(infrared) |
IR
(infrarouge) |
|
iron,
soldering |
fer
à souder |
|
JEDEC
(Joint Electronic Device Engineering Council) |
JEDEC
(Conseil des ingenieurs unifies en corposants |
|
|
electroniques) |
|
JIT (juste in time) |
AT (juste à temps) |
|
jumper |
fil
de jonction, de liaison ou de reprise; cavalier |
|
lamination |
stratification;
pressage |
|
land |
pastille |
|
lap
joint |
assenlblago
à recouvrenlont; (chit à mcouviemoIt |
|
lay
up; stack up |
enrpilage;
ernpllement |
|
LCC
(lead less chip carrier) |
boitier
sans broches |
|
LCCC
(leadless ceramic chip carrier) |
boitier
ceramique sans broches |
|
LCD
(liquid crystal display) |
ECL
(ecran à cristaux liquides) |
|
leaching |
lessivage |
|
lead
frame |
grille
de connexion; araignee |
|
brasure
excessive lead |
joint
brase excessif |
|
earth/ground |
cable
de masse |
|
LED
(light emitting diode) |
|
|
LGA
(land grid array) |
boitier
LGA |
|
lid |
couvercle;
capot |
|
LID
(leadless inverted device) |
LID
(composant inverse sans broches) |
|
light-emitting
diode (LED) |
diode
electroluminescente ( |
|
logic
integrated circuit |
circuit
integre logique |
|
LPI
(liquid photo imageable) |
LPI
(liquide photo-imageable) |
|
LSI
(large scale integration) |
LSI
(integration a large echelle) |
|
mask |
masque |
|
MCM
(multi chip module) |
MCM
(module a puces multiples) |
|
measling |
delamination;
points blancs |
|
MEFB
(metal electrode face bonded) |
MEFB
(assemblage a face d'electrode metallisee) |
|
MELF
(metal electrode face) |
MELF
(composant miniature cylindrique) |
|
melting
point |
point
de fusion |
|
memory |
memoire |
|
MEPPE
(Microelectronic Packaging and Processing |
MEPPE
(Ingenieurs en procedes et boitiers pour la |
|
Engineers) |
micro-electronique) |
|
metal
can |
boitier
metallique |
|
metal,
base |
metal
de base |
|
metal,
brazing |
metal
d'apport |
|
microprocessor |
microprocesseur |
|
MLCC
(metal leaded chip carrier) |
MLCC
(porte-puce a contacts metalliques) |
|
molten
solder |
soudure
fondue; brasure fondue |
|
mounting
hole |
trou
de montage |
|
MQFP
(metric quad flat pack) |
MQFP
(boitier quadrangulaire plat metrique) |
|
MTM
(multiple termination module) |
MTM
(module a terminaisons multiples) |
|
MTTF
(mean time to failure) |
MTTF
(temps moyen jusqu'a defectuosite) |
|
multilayer
card |
carte
multicouche |
|
nick |
entaille |
|
nickel
plating |
nickelage |
|
nonwetting |
non-mouillage |
|
nozzle |
bec;
buse |
|
OSP
(organic solderability preservative) |
OSP
(protecteur organique de soudabilite) |
|
outer
layer |
couche
externe |
|
overheat |
surchauffe |
|
overheated
joint |
joint
surchauffe |
|
overlap |
chevauchement |
|
oxidation,
surface oxides |
oxydation;
la couche d'oxydes; scories |
|
oxide
treatment; oxidation |
oxydation |
|
package |
boitier |
|
packaging |
encapsulation;
mise en boitier |
|
pad |
pastille |
|
panel |
panneau |
|
panel
plating |
cuivrage
total |
|
part |
piece |
|
pattern
plating |
cuivrage
selectif |
|
PBGA
(ball grid array) |
boitier
PBGA (boitier plastique a contacts perles) |
|
PCB
(printed circuit board) |
PCB
(circuit/plaquette de circuit imprime) |
|
PCMCIA
(Personal Computer Memory Card International |
PCMCIA
(Association internationale pour les cartes |
|
Association) |
memoires
d'ordinateurs personnels) |
|
PGA
(pin grid array) |
boitier
fakir (boitier a pics en reseau) |
|
photoresist
application |
application
de la resine photosensible |
|
photoresist
lamination |
application
de la pellicule photoresistante |
|
phototool;
photomask |
masque
photographique |
|
pin |
broche
de connexion |
|
pinhole |
piqure |
|
pit |
cratere |
|
plated-through
hole (PTH) |
trou
metallise |
|
PLCC
(plastic leaded chip carrier) |
boitier
plastique avec broches (en "J") |
|
polarizing
slot |
detrompeur;
rainure de polarisation |
|
polymerized
resist |
resine
polymerizee |
|
porous
solder joint |
joint
brase poreux; brasure poreuse |
|
power
supply |
bloc
d'alimentation |
|
PQFP
(plastic quad flat pack) |
boitier
plastique avec broches sur les quatre cotes |
|
preheating |
prechauffage |
|
prepreg |
feuille
de preimpregne |
|
pressure |
pression |
|
pretinning |
pre-etamage |
|
print
and etch method |
methode
de gravure directe |
|
printed
circuit board assembly (PCB assembly) |
carte
de circuit imprime equipee; carte de circuit imprime |
|
|
montee |
|
PROM (programmable read only memory) |
PROM (memoire a lecture seule, programmable) |
|
PRT
(planar resistance technology) |
PRT
(technologie de resistances planes) |
|
PTH
(plated through hole) |
PTH
(trou metallise) |
|
pumice
scrubbing |
brossage
a la |
|
PWA
(printed wire assembly) |
PWA
(circuit imprime/plaquette de circuit imprime) |
|
QFP
(quad flat pack) |
QFP
(boitier plat quadrangulaire) |
|
quartz
crystal |
resonateur
a quartz |
|
QUIP
(quad-in-line package) |
boltier
a quatre rangees de broches |
|
RA
(rosin activated) |
RA
(resine (colophane) activee) |
|
radial
lead |
sortie
radiate |
|
requirements |
specifications |
|
reflow
soldering |
soudage;
brasage par refusion |
|
registration
hole; tooling hole |
trou
de repere |
|
relay |
relais
mecanique |
|
repair |
reparation |
|
residual
stress(es) |
tensions
residuelles |
|
resin |
resine |
|
resist |
masque;
epargne |
|
resistor |
resistance |
|
resistor,
carbon film |
resistance
a couche de carbone |
|
resistor,
metal film |
resistance
a couche metallique |
|
resistor,
variable (potentiometer) |
resistance
variable (potentiometre) |
|
resistor,
wirewound |
resistance
bobinee |
|
rework |
reprise;
retouche |
|
RH
(relative humidity) |
HR
(humidity relative) |
|
RMA
(rosin mildly activated) |
RMA
(resine (colophane) legerement activee) |
|
ROM
(read only memory) |
ROM
(memoire a lecture seule) |
|
rosin |
resine;
arcanson; colophane |
|
rosin
solder joint |
joint
brase resineux; brasure resineuse |
|
routing |
detourage |
|
scouring,
stripping, cleaning |
decapage |
|
scratch |
egratignure;
rayure |
|
shank |
manche |
|
shearing |
decoupage
a la cisaille |
|
shield |
blindage |
|
silk
screen |
serigraphie |
|
SIP
(single-in-line package) |
boitier
a une rangee de broches |
|
SIR
(surface insulation resistance) |
SIR
(resistance d'isolant de surface) |
|
SMC
(surface mount component) |
CMS
(composant a monter en surface) |
|
SMD
(surface mount device) |
DMS
(dispositif monte en surface) |
|
SMEMA
(Surface |
SMEMA
(Association des manufacturiers d'equipement pour |
|
Association) |
montage
en surface) |
|
SMOBC
(solder mask over bare copper) |
SMOBC
(masque de brasure sur cuivre nu) |
|
SMT
(surface mount technology) |
TCMS
(technique de montage en surface; montage en |
|
|
surface
) |
|
SMTA (Surface |
SMTA (Association de la technologie de montage en surface) |
|
SO
(small outline package) |
bonier
a faible encombrement |
|
socket |
support;
douille; receptacle |
|
SOD
(small outline diode) |
diode
a faible encombrement |
|
SOIC
(small outline integrated circuit) |
circuit
integre a faible encombrement |
|
SOJ
(small outline J leads) |
SOJ
(boitier a faible encombrement, a broches en "J") |
|
solder |
soudure
a I'etain; brasure tendre; metal ou aliiage d'apport |
|
solderability |
soudabilite;
brasabilite |
|
solder
bridge |
pont
de soudure; pont d'alliage |
|
solder
joint |
joint
brase |
|
solder
mask |
masque
de soudure; masque de brasage |
|
solder
mask application |
application
du masque de soudure |
|
solder
mask over bare copper (SMOBC) |
finition
cuivre nu |
|
solder
side (secondary side) |
cote
soudure (cote secondaire) |
|
solder
spatter |
eclaboussure
de soudure |
|
solder
spike/peak |
pointe;
pic d'alliage d'apport |
|
solder
tack |
amorce
ou point de soudure |
|
solder
wick; braid |
tresse
a dessouder |
|
soldering |
soudage;
brasage tendre |
|
soldering
iron |
fer
a souder |
|
soldering
tip |
pointe;
panne de fer a souder |
|
soldering/desoldering
(rework) station |
poste
a souder/dessouder |
|
SOLIC
(small outline large integrated circuit) |
SOLIC
(circuit integre large a connexions courtes) |
|
solvent |
solvant |
|
SOP
(small outline package) |
SOP
(boitier a connexion courtes) |
|
SOT
(small outline transistor) |
boitier
de transistor a connexions courtes |
|
spacing |
espacement |
|
spatter |
projection
(de soudure) |
|
SPC
(statistical process control) |
SPC
(procedure de controle statistique) |
|
splice |
epissure |
|
SQFP
(shrink quad flat pack) |
SQFP
(boitier quadrangulaire plat retreci) |
|
SSOP
(shrink small outline package) |
SSOP
(boitier retreci a faible encombrement) |
|
stress |
contrainte;
tension mecanique residuelle |
|
stress
relief (loop) |
soulagement
de contrainte (boucle de detente) |
|
stress(es),
residual |
tensions
residuelles |
|
strip |
barrette |
|
stripping |
decapage;
denudage |
|
substrate |
substrat |
|
surface
mounting |
montage
en surface |
|
surface
tension |
tension
de surface |
|
switch |
interrupteur |
|
TAB
(tape automated bonding) |
TAB
(ruban a adhesion automatisee) |
|
tacking,
to tack |
pointage,
pointer |
|
TBGA
(tape ball grid array) |
boitier
TBGA (boitier ruban a contacts perles) |
|
TCE
(thermal coefficient of expansion) |
CET
(coefficient d'expansion thermique) |
|
tensile
test |
essai
de traction |
|
tenting
process |
masquage
par voile |
|
terminal:
turret, cup, hook, pierced, straight-pin, |
borne;
picot : tourelle; a clous, creuse(eux); en coupelle, |
|
bifurcated;
split; fork |
perce(e);
plat(e) ou a oeil, droit(e), a fourche; fendu(e) |
|
terminal
block |
bornier |
|
termination |
terminaison |
|
termination
area |
zone
terminale |
|
thermal
shunt |
shunt
thermique |
|
thermistor |
thermistance |
|
through-hole
mount component |
composant
a inserer; composant traversant |
|
through-hole
mounting |
montage
par insertion; montage traversant |
|
thyristor |
thyristor |
|
tilt |
inclinaison |
|
tin-lead
electroplating |
depot
electrolytique d'etain-plomb |
|
tinning |
etamage |
|
tinning
pot |
pot
a etamer |
|
tip,
soldering |
pointe;
panne de fer a souder |
|
TO
(transistor outline package) |
boitier
TO (transistor) |
|
TQFP
(thin quad flat pack) |
TQFP
(boitier quadrangulaire mince) |
|
trace;
conductor |
piste;
conducteur |
|
transformer |
transformateur |
|
transistor |
transistor |
|
TRIAL |
TRIAC |
|
trimmer
potentiometer |
potentiometre
de precision; potentiometre d'ajustement |
|
TSOP
(thin small outline package) |
TSOP
(boitier mince a faible encombrement) |
|
turret
terminal |
picot
tourelle; borne tourelle |
|
tweezer |
brucelles |
|
twist |
torsion |
|
UFPT
(ultra fine pitch technology) |
UFPT
(technologie des composant a peignes ultra-fins) |
|
ultraviolet
light (UV light) |
rayonnement
ultraviolet (rayonnement UV) |
|
UV
(ultraviolet) |
UV
(ultraviolet) |
|
vacuum
press |
presse
sous vide |
|
varistor |
varistance |
|
via |
via |
|
visual
inspection |
inspection
visuelle; controle visuel |
|
VLSI
(very large scale integration) |
VLSI
(integration a grande echelle) |
|
VOC
(volatile organic compound) |
COV
(compose organique volatile) |
|
void |
poche;
vide |
|
VSOP
(very small outline package) |
VSOP
(boitier a tres faible encombrement) |
|
warping |
gauchissement;
gondolage |
|
webbing |
eclaboussure
ou toile de soudure (sans adherance) |
|
wetting |
mouillage |
|
wicking |
effet
de meche; impregnation |
|
wicking
braid |
tresse
a dessouder |
|
wire |
fil |
|
wire
stripper |
denudeuse;
pince a denuder |
|
Zener
diode |
diode
Zener |
|
ZIF
(zero insertion force) |
ZIF
(force d'insertion zero) |