GLOSSAIRE - SOUDAGE TENDRE
|
FRANCAIS |
ANGLAIS |
|
alliage |
alloy |
|
circuit
integre analogique |
analogic;
linear integrated circuit |
|
ensemble |
assemblly |
|
appareil
de verification automatique |
ATE
(automatic test equipment) |
|
composant
à sorties axiales |
axial
leads component |
|
etuvage |
baking |
|
metal
de base |
base
metal |
|
chanfrein |
bevel |
|
chanfreinage |
bevelling |
|
boitier
BGA (boitier à contacts perles) |
BGA
(ball grid array) |
|
boitier
BGA à colonnes (boltier à contacts perles semi-rigid |
BGA,
column (column ball grid array) |
|
separation
des brins |
birdcage |
|
decoupage
à la presse |
blanking |
|
Soufflu
re |
blow
hole |
|
carte;
plaquette |
board |
|
boitier
quadrangulaire plat à pare-chocs |
BQFP
(bumper quad flat pack) |
|
laiton |
brass |
|
brasure |
braze |
|
brasage |
Brazing |
|
metal
d'apport |
brazing
metal |
|
cassure |
break |
|
pont
redresseur |
bridge
rectifier |
|
burin |
bur(r) |
|
polissage |
burnishing |
|
barre
omnibus |
bus
bar |
|
fil
de jonction ou de liaison |
bus
wire |
|
assemblage/joint
bout à bout |
butt
joint |
|
DAO
(dessin assiste par ordinateur) |
CAD
(computer aided design) |
|
FAO
(fabrication assistee par ordinateur) |
CAM
(computer aided manufacture) |
|
condensateur
ajustable (variable) |
capacitor,
adjustable (trimmer capacitor) |
|
condensateur
electrolytique à ('aluminium |
capacitor,
aluminum electrolytic |
|
condensateur
au mica |
capacitor,
mica |
|
condensateur
ceramique multicouche |
capacitor,
multilayer ceramic |
|
condensateur
à film plastique |
capacitor,
plastic film |
|
condensateur
electrolytique au tantale |
capacitor,
tantalum electrolytic |
|
capillarite |
capillarity |
|
boitier
CBGA (boitier ceramique à contacts perles) |
CBGA
(ceramic ball grid array) |
|
boitier
ceramique à deux rangees de broches |
CERDIP
(ceramic dual-in-line package) |
|
FCC
(fluoro carbones chlorines) |
CFC
(chlorinated fluoro carbons) |
|
puce;
circuit integre |
chip |
|
condensateur
miniature |
chip
capacitor |
|
porte-puce;
boitier pave |
chip
carrier |
|
composant
miniature |
chip
component |
|
resistance
miniature |
chip
resistor |
|
boitier
ceramique avec broches |
CLCC
(ceramic leaded chip carrier) |
|
degagement |
clearance |
|
sortie
repliee; connexion rabattue |
clinched
lead |
|
CMOS
uSOMC» (semi-conducteur à oxyde de metal |
CMOS
(complementary metal oxide semiconductor) |
|
complementaire) |
|
|
COB (Cl sur plaquette) |
COB (chip on board) |
|
trou
de connexion |
component
hole |
|
patte
de composant; broche; terminaison; sortie |
component
lead |
|
montage
des composants |
component
mounting |
|
cOte
composant |
component
side |
|
soudage;
brasage par conduction |
conduction
soldering |
|
conducteur;
piste |
Conductor |
|
vernis de recouvrement; vernis de
tropicalisation |
conformal coating |
|
connexion |
connection |
|
connecteur |
connector |
|
doigts de contact |
contact finger |
|
revetement metallique des doigts de contact |
contact finger plating |
|
surface de contact; plage de contact |
contact pad |
|
contaminant |
contaminant |
|
cuivrage electrolytique |
copper electroplating |
|
gravure du cuivre |
copper etching |
|
feuille de cuivre |
copper foil |
|
stratifie cuivre |
copper-clad laminate |
|
CPS (cycles par seconde) |
CPS (cycles per second) |
|
boitier ceramique plat, quadrangulaire |
CQFP (ceramic quad flat pack) |
|
fissure de cratere |
crack, crater |
|
fissuration |
crading |
|
cratere |
crater |
|
TRC (tube a rayons cathodiques) |
CRT (cathode ray tube) |
|
CET (coefficient d'expansion thermique) |
CTE (coefficient of thermal expansion) |
|
cuisson |
curing |
|
DCA (attache directe de composant) |
DCA (direct chip attach) |
|
ebavurage; ebarbage |
deburring |
|
degraissant |
degreaser |
|
degraissage |
degreasing |
|
developpement |
development |
|
DPF (dessin pour fabrication) |
DFM (design for manufacturability) |
|
bain |
dip |
|
boitier DIP; boitier a deux rangees de
broches |
DIP (double-in-line package) |
|
trempage |
dipping |
|
joint brase perturbe; brasure perturbee |
disturbed solder joint |
|
DPM (defaut par million) |
DPM (defect per million) |
|
DRAM (memoire a acces aleatoire dynamique) |
DRAM (dynamic random access memory) |
|
lore,; meche |
drill bit |
|
pergage |
drilling |
|
perceuse |
drilling machine |
|
ecume (soudure) |
dross (solder) |
|
film sec |
dry film |
|
ductilite |
ductility |
|
composant factice |
dummy component |
|
connecteur encartab!e |
edge connector |
|
EIA (Association des industries
electroniques) |
EIA (Electronic Industries Association) |
|
depot chimique de cuivre |
electroless copper deposit |
|
cuivrage chimique |
electroless copper plating |
|
depot de cuivre par electrolyse |
electroplated copper |
|
depot electrolytique d'etain-plomb |
electroplated tin-lead |
|
EMC (compatibilite electromagnetique) |
EMC (electromagnetic compatibility) |
|
EMI (interference electromagnetique) |
EMI (electromagnetic interference) |
|
EMPF (facilite de fabrication productive
electroni(Iue) |
EMPF (electronics manufacturing
productivity facility) |
|
stratifie verre-epoxyde |
epoxy-glass laminate |
|
EPROM (memoire a lecture seule, effacement |
EPROM (erasable programmable read only
memory) |
|
programmable) |
|
|
DES (decharge electrostatique) |
ESD (electrostatic discharge) |
|
masque de gravure |
etch resist |
|
agent de gravure; mordant |
etchant |
|
retrogravure; gravure en retrait |
etchback |
|
oeillet |
eyelet |
|
pastille; conducteur; piste |
eyepad, conductor, land |
|
Exposition |
exposure |
|
Lime |
file |
|
filet;
conge; cordon : concave |
fillet,
concave |
|
filet;
conge; cordon : convexe |
fillet,
convex |
|
verification
finale |
final
inspection |
|
composant
à peigne fin |
fine
pitch component |
|
fluidite |
fluidity |
|
decapant;
flux |
flux |
|
joint
brase fissure; brasure fissuree |
fractured
solder joint |
|
FRS
(soudure resistante à la fatigue) |
FRS
(fatigue resistant solder) |
|
FRU
(unite remplaceable sur le terrain) |
FRU
(field replaceable unit) |
|
collage |
fusion,
incomplete |
|
soufflure |
gas
pocket |
|
piqure |
gas
pore |
|
dorure |
gold
plating |
|
gravity |
gravity |
|
masse |
ground |
|
mise
à la masse |
ground
connection |
|
cosse
plate; picot plat; cosse à oeil |
lug
terminal |
|
composants
à sorties en "L" |
gull
wing components |
|
effet
de halo |
haloing |
|
HASL
(nivelage de soudure à fair chaud) |
HASL
(hot air solder levelling) |
|
HCFC
(fluoro carbones chlorines hydrogenes) |
HCFC
(hydrogenated chloro fluoro carbon) |
|
dissipateur
thermique; radiateur |
heat
sink |
|
talon |
heel |
|
paroi
de trou |
hole
sidewall |
|
nivelage
de I'etain-plomb à ('air chaud |
hot
air solder levelling (HASL) |
|
circuit
hybride |
hybrid
circuit |
|
presse
hydraulique |
hydraulic
press |
|
Cl
(circuit integre) |
IC
(integrated circuit) |
|
glagon;
pic |
icicle |
|
report
de ('image; transfert de I' image |
image
transfer; imaging |
|
couche
interne |
inner
layer |
|
isolant |
insulation |
|
circuit
integre (CI) |
integrated
circuit (IC) |
|
connexion
inter-couche |
interlayer
connection |
|
IPC
(Institut pour emboitage et ('interconnection des circuits |
IPC
(Institute for Interconnecting and Packaging |
|
electronique)
- normes de procedures |
Electronic
Circuits) - procedures standards |
|
IR
(infrarouge) |
IR
(infrared) |
|
fer
à souder |
iron,
soldering |
|
JEDEC
(Conseil des ingenieurs unifies en corposants |
JEDEC
(Joint Electronic Device Engineering Council) |
|
electroniques) |
|
|
AT (juste à temps) |
JIT (juste in time) |
|
fil
de jonction, de liaison ou de reprise; cavalier |
jumper |
|
stratification;
pressage |
lamination |
|
pastille |
land |
|
assenlblago
à recouvrenlont; (chit à mcouviemoIt |
lap
joint |
|
enrpilage;
ernpllement |
lay
up; stack up |
|
boitier
sans broches |
LCC
(lead less chip carrier) |
|
boitier
ceramique sans broches |
LCCC
(leadless ceramic chip carrier) |
|
ECL
(ecran à cristaux liquides) |
LCD
(liquid crystal display) |
|
lessivage |
leaching |
|
grille
de connexion; araignee |
lead
frame |
|
joint
brase excessif |
brasure
excessive lead |
|
cable
de masse |
earth/ground |
|
DEL
(diode electroluminescente) |
LED
(light emitting diode) |
|
boitier
LGA |
LGA
(land grid array) |
|
couvercle;
capot |
lid |
|
LID
(composant inverse sans broches) |
LID
(leadless inverted device) |
|
diode
electroluminescente (DEL) |
light-emitting
diode (LED) |
|
circuit
integre logique |
logic
integrated circuit |
|
LPI
(liquide photo-imageable) |
LPI
(liquid photo imageable) |
|
LSI
(integration a large echelle) |
LSI
(large scale integration) |
|
masque |
mask |
|
MCM
(module a puces multiples) |
MCM
(multi chip module) |
|
delamination;
points blancs |
measling |
|
MEFB
(assemblage a face d'electrode metallisee) |
MEFB
(metal electrode face bonded) |
|
MELF
(composant miniature cylindrique) |
MELF
(metal electrode face) |
|
point
de fusion |
melting
point |
|
memoire |
memory |
|
MEPPE
(Ingenieurs en procedes et boitiers pour la |
MEPPE
(Microelectronic Packaging and Processing |
|
micro-electronique) |
Engineers) |
|
boitier
metallique |
metal
can |
|
metal
de base |
metal,
base |
|
metal
d'apport |
metal,
brazing |
|
microprocesseur |
microprocessor |
|
MLCC
(porte-puce a contacts metalliques) |
MLCC
(metal leaded chip carrier) |
|
soudure
fondue; brasure fondue |
molten
solder |
|
trou
de montage |
mounting
hole |
|
MQFP
(boitier quadrangulaire plat metrique) |
MQFP
(metric quad flat pack) |
|
MTM
(module a terminaisons multiples) |
MTM
(multiple termination module) |
|
MTTF
(temps moyen jusqu'a defectuosite) |
MTTF
(mean time to failure) |
|
carte
multicouche |
multilayer
card |
|
entaille |
nick |
|
nickelage |
nickel
plating |
|
non-mouillage |
nonwetting |
|
bec;
buse |
nozzle |
|
OSP
(protecteur organique de soudabilite) |
OSP
(organic solderability preservative) |
|
couche
externe |
outer
layer |
|
surchauffe |
overheat |
|
joint
surchauffe |
overheated
joint |
|
chevauchement |
overlap |
|
oxydation;
la couche d'oxydes; scories |
oxidation,
surface oxides |
|
oxydation |
oxide
treatment; oxidation |
|
boitier |
package |
|
encapsulation;
mise en boitier |
packaging |
|
pastille |
pad |
|
panneau |
panel |
|
cuivrage
total |
panel
plating |
|
piece |
part |
|
cuivrage
selectif |
pattern
plating |
|
boitier
PBGA (boitier plastique a contacts perles) |
PBGA
(ball grid array) |
|
PCB
(circuit/plaquette de circuit imprime) |
PCB
(printed circuit board) |
|
PCMCIA
(Association internationale pour les cartes |
PCMCIA
(Personal Computer Memory Card International |
|
memoires
d'ordinateurs personnels) |
Association) |
|
boitier
fakir (boitier a pics en reseau) |
PGA
(pin grid array) |
|
application
de la resine photosensible |
photoresist
application |
|
application
de la pellicule photoresistante |
photoresist
lamination |
|
masque
photographique |
phototool;
photomask |
|
broche
de connexion |
pin |
|
piqure |
pinhole |
|
cratere |
pit |
|
trou
metallise |
plated-through
hole (PTH) |
|
boitier
plastique avec broches (en "J") |
PLCC
(plastic leaded chip carrier) |
|
detrompeur;
rainure de polarisation |
polarizing
slot |
|
resine
polymerizee |
polymerized
resist |
|
joint
brase poreux; brasure poreuse |
porous
solder joint |
|
bloc
d'alimentation |
power
supply |
|
boitier
plastique avec broches sur les quatre cotes |
PQFP
(plastic quad flat pack) |
|
prechauffage |
preheating |
|
feuille
de preimpregne |
prepreg |
|
pression |
pressure |
|
pre-etamage |
pretinning |
|
methode
de gravure directe |
print
and etch method |
|
carte
de circuit imprime equipee; carte de circuit imprime |
printed
circuit board assembly (PCB assembly) |
|
montee |
|
|
PROM (memoire a lecture seule, programmable) |
PROM (programmable read only memory) |
|
PRT
(technologie de resistances planes) |
PRT
(planar resistance technology) |
|
PTH
(trou metallise) |
PTH
(plated through hole) |
|
brossage
a la pierre ponce |
pumice
scrubbing |
|
PWA
(circuit imprime/plaquette de circuit imprime) |
PWA
(printed wire assembly) |
|
QFP
(boitier plat quadrangulaire) |
QFP
(quad flat pack) |
|
resonateur
a quartz |
quartz
crystal |
|
boltier
a quatre rangees de broches |
QUIP
(quad-in-line package) |
|
RA
(resine (colophane) activee) |
RA
(rosin activated) |
|
sortie
radiate |
radial
lead |
|
specifications |
requirements |
|
soudage;
brasage par refusion |
reflow
soldering |
|
trou
de repere |
registration
hole; tooling hole |
|
relais
mecanique |
relay |
|
reparation |
repair |
|
tensions
residuelles |
residual
stress(es) |
|
resine |
resin |
|
masque;
epargne |
resist |
|
resistance |
resistor |
|
resistance
a couche de carbone |
resistor,
carbon film |
|
resistance
a couche metallique |
resistor,
metal film |
|
resistance
variable (potentiometre) |
resistor,
variable (potentiometer) |
|
resistance
bobinee |
resistor,
wirewound |
|
reprise;
retouche |
rework |
|
HR
(humidity relative) |
RH
(relative humidity) |
|
RMA
(resine (colophane) legerement activee) |
RMA
(rosin mildly activated) |
|
ROM
(memoire a lecture seule) |
ROM
(read only memory) |
|
resine;
arcanson; colophane |
rosin |
|
joint
brase resineux; brasure resineuse |
rosin
solder joint |
|
detourage |
routing |
|
decapage |
scouring,
stripping, cleaning |
|
egratignure;
rayure |
scratch |
|
manche |
shank |
|
decoupage
a la cisaille |
shearing |
|
blindage |
shield |
|
serigraphie |
silk
screen |
|
boitier
a une rangee de broches |
SIP
(single-in-line package) |
|
SIR
(resistance d'isolant de surface) |
SIR
(surface insulation resistance) |
|
CMS
(composant a monter en surface) |
SMC
(surface mount component) |
|
DMS
(dispositif monte en surface) |
SMD
(surface mount device) |
|
SMEMA
(Association des manufacturiers d'equipement pour |
SMEMA
(Surface Mount Equipment Manufacturers |
|
montage
en surface) |
Association) |
|
SMOBC
(masque de brasure sur cuivre nu) |
SMOBC
(solder mask over bare copper) |
|
TCMS
(technique de montage en surface; montage en |
SMT
(surface mount technology) |
|
surface
) |
|
|
SMTA (Association de la technologie de montage en surface) |
SMTA (Surface Mount Technology Association) |
|
bonier
a faible encombrement |
SO
(small outline package) |
|
support;
douille; receptacle |
socket |
|
diode
a faible encombrement |
SOD
(small outline diode) |
|
circuit
integre a faible encombrement |
SOIC
(small outline integrated circuit) |
|
SOJ
(boitier a faible encombrement, a broches en "J") |
SOJ
(small outline J leads) |
|
soudure
a I'etain; brasure tendre; metal ou aliiage d'apport |
solder |
|
soudabilite;
brasabilite |
solderability |
|
pont
de soudure; pont d'alliage |
solder
bridge |
|
joint
brase |
solder
joint |
|
masque
de soudure; masque de brasage |
solder
mask |
|
application
du masque de soudure |
solder
mask application |
|
finition
cuivre nu |
solder
mask over bare copper (SMOBC) |
|
cote
soudure (cote secondaire) |
solder
side (secondary side) |
|
eclaboussure
de soudure |
solder
spatter |
|
pointe;
pic d'alliage d'apport |
solder
spike/peak |
|
amorce
ou point de soudure |
solder
tack |
|
tresse
a dessouder |
solder
wick; braid |
|
soudage;
brasage tendre |
soldering |
|
fer
a souder |
soldering
iron |
|
pointe;
panne de fer a souder |
soldering
tip |
|
poste
a souder/dessouder |
soldering/desoldering
(rework) station |
|
SOLIC
(circuit integre large a connexions courtes) |
SOLIC
(small outline large integrated circuit) |
|
solvant |
solvent |
|
SOP
(boitier a connexion courtes) |
SOP
(small outline package) |
|
boitier
de transistor a connexions courtes |
SOT
(small outline transistor) |
|
espacement |
spacing |
|
projection
(de soudure) |
spatter |
|
SPC
(procedure de controle statistique) |
SPC
(statistical process control) |
|
epissure |
splice |
|
SQFP
(boitier quadrangulaire plat retreci) |
SQFP
(shrink quad flat pack) |
|
SSOP
(boitier retreci a faible encombrement) |
SSOP
(shrink small outline package) |
|
contrainte;
tension mecanique residuelle |
stress |
|
soulagement
de contrainte (boucle de detente) |
stress
relief (loop) |
|
tensions
residuelles |
stress(es),
residual |
|
barrette |
strip |
|
decapage;
denudage |
stripping |
|
substrat |
substrate |
|
montage
en surface |
surface
mounting |
|
tension
de surface |
surface
tension |
|
interrupteur |
switch |
|
TAB
(ruban a adhesion automatisee) |
TAB
(tape automated bonding) |
|
pointage,
pointer |
tacking,
to tack |
|
boitier
TBGA (boitier ruban a contacts perles) |
TBGA
(tape ball grid array) |
|
CET
(coefficient d'expansion thermique) |
TCE
(thermal coefficient of expansion) |
|
essai
de traction |
tensile
test |
|
masquage
par voile |
tenting
process |
|
borne;
picot : tourelle; a clous, creuse(eux); en coupelle, |
terminal:
turret, cup, hook, pierced, straight-pin, |
|
perce(e);
plat(e) ou a oeil, droit(e), a fourche; fendu(e) |
bifurcated;
split; fork |
|
bornier |
terminal
block |
|
terminaison |
termination |
|
zone
terminale |
termination
area |
|
shunt
thermique |
thermal
shunt |
|
thermistance |
thermistor |
|
composant
a inserer; composant traversant |
through-hole
mount component |
|
montage
par insertion; montage traversant |
through-hole
mounting |
|
thyristor |
thyristor |
|
inclinaison |
tilt |
|
depot
electrolytique d'etain-plomb |
tin-lead
electroplating |
|
etamage |
tinning |
|
pot
a etamer |
tinning
pot |
|
pointe;
panne de fer a souder |
tip,
soldering |
|
boitier
TO (transistor) |
TO
(transistor outline package) |
|
TQFP
(boitier quadrangulaire mince) |
TQFP
(thin quad flat pack) |
|
piste;
conducteur |
trace;
conductor |
|
transformateur |
transformer |
|
transistor |
transistor |
|
TRIAC |
TRIAL |
|
potentiometre
de precision; potentiometre d'ajustement |
trimmer
potentiometer |
|
TSOP
(boitier mince a faible encombrement) |
TSOP
(thin small outline package) |
|
picot
tourelle; borne tourelle |
turret
terminal |
|
brucelles |
tweezer |
|
torsion |
twist |
|
UFPT
(technologie des composant a peignes ultra-fins) |
UFPT
(ultra fine pitch technology) |
|
rayonnement
ultraviolet (rayonnement UV) |
ultraviolet
light (UV light) |
|
UV
(ultraviolet) |
UV
(ultraviolet) |
|
presse
sous vide |
vacuum
press |
|
varistance |
varistor |
|
via |
via |
|
inspection
visuelle; controle visuel |
visual
inspection |
|
VLSI
(integration a grande echelle) |
VLSI
(very large scale integration) |
|
COV
(compose organique volatile) |
VOC
(volatile organic compound) |
|
poche;
vide |
void |
|
VSOP
(boitier a tres faible encombrement) |
VSOP
(very small outline package) |
|
gauchissement;
gondolage |
warping |
|
eclaboussure
ou toile de soudure (sans adherance) |
webbing |
|
mouillage |
wetting |
|
effet
de meche; impregnation |
wicking |
|
tresse
a dessouder |
wicking
braid |
|
fil |
wire |
|
denudeuse;
pince a denuder |
wire
stripper |
|
diode
Zener |
Zener
diode |
|
ZIF
(force d'insertion zero) |
ZIF
(zero insertion force) |